| 摘要 |
Provided is an epoxy resin composition, which has excellent penetration and underfill properties into a gap between a board and a bare chip and is uniformly curable over the full range of a wide chip surface, and produces chip packages having high reliability. The epoxy resin composition comprises 100 parts by weight of an epoxy resin which is liquid at ambient temperature and has at least two glycidyl groups in the molecule, 10-50 parts by weight of a reactive diluent having at least one glycidyl group in the molecule, 50-200 parts by weight, based on 100 parts by weight of the epoxy resin and reactive diluent, of an acid anhydride hardener which is liquid at ambient temperature, and 1-20 parts by weight of a latent hardening accelerator based on 100 parts by weight of the epoxy resin, reactive diluent, and acid anhydride hardener. The epoxy resin composition has a viscosity of 250-500cps at 25°C and a gelation time of 120seconds at 150°C.
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