| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board in which component land width is different from signal wiring width, or signal wiring whose wiring width is different is intermingled, and any impedance mismatching is not generated and a method for manufacturing the wiring board, and to achieve highly dense signal wiring and thin wiring board whose signal quality is stable. SOLUTION: In a wiring board where signal wiring 9 whose width is thin and signal wiring 7 whose width is wide are formed on the surface of a dielectric layer 5A so as to be intermingled, a dielectric layer 8 whose dielectric rate is different from that of the dielectric layer 5A is arranged under the signal wiring 7 whose width is wide so that it is possible to increase the characteristic impedance of the signal wiring 7 whose width is wide, and to match the characteristic impedance with that of the signal wiring 9 whose signal line width is thin. COPYRIGHT: (C)2007,JPO&INPIT |
