发明名称 WRAPPING MATERIAL FOR ELECTRONIC COMPONENT CASE, AND CASE FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a wrapping material for an electronic component case showing a superior rigidity and capable of attaining a superior outer appearance with hardly allowing visual recognition of roll traces, scratches or the like on an aluminum foil even if a rolled trace or a scratch or the like is left at an aluminum foil. SOLUTION: This wrapping material for electronic component cases comprises a heat-resistant resin oriented film layer 2 acting as an outer layer, a thermoplastic resin non-oriented film layer 3 acting as an inner layer, and an aluminum foil layer 4 arranged between these film layers. The aluminum foil layer 4 is made by laminating a hard aluminum foil 5 arranged at the inner layer 3 and an aluminum foil 6 on the outer layer 2 in which at least the outer layer is formed as a mat surface. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007161310(A) 申请公布日期 2007.06.28
申请号 JP20050361195 申请日期 2005.12.15
申请人 SHOWA DENKO PACKAGING CO LTD 发明人 HATA HIROSHI
分类号 B65D65/40;B32B15/08;B32B15/20;B65D85/00;B65D85/86;H01G9/08;H01M2/02 主分类号 B65D65/40
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