| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition for flexible base boards excellent in adhesiveness and having little heat degradability, a flexible copper-clad laminate using the adhesive composition and a flexible printed wiring board in which circuits are formed on the laminate. SOLUTION: The adhesive composition for flexible base board comprises (A) an epoxy resin, (B) a curing agent for the epoxy resin, (C) a curing promotor for the epoxy resin, (D) an elastomer, (E) a phenolic age resister and (F) a sulfur-based age resister and the content of the (D) component is 20-80 mass% based on a solid content of the adhesive composition. The flexible copper-clad laminate using the adhesive composition and the flexible printed wiring board formed with the circuit on the laminate are also provided. COPYRIGHT: (C)2007,JPO&INPIT |
