发明名称 |
Method of manufacturing an electronic protection device |
摘要 |
A method of manufacturing an electronic protection device comprises: providing a substrate mother board with a top surface and a bottom surface; forming a first conductive layer and a second conductive layer on the top surface and the bottom surface, respectively; cutting the substrate mother board into a plurality of strip-shaped substrates; and forming insulating layers on surfaces of each of the strip-shaped substrates that are not covered by the first conductive layer and the second conductive layer.
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申请公布号 |
US2007148823(A1) |
申请公布日期 |
2007.06.28 |
申请号 |
US20060641830 |
申请日期 |
2006.12.20 |
申请人 |
HUANG CHIEN-HAO;LI WEN-CHIH |
发明人 |
HUANG CHIEN-HAO;LI WEN-CHIH |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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