| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a chip type array electronic component which can reduce failure due to short circuit between terminals by preventing a conductive paste forming an upper surface electrode from unnecessarily oozing into a split groove, and can remarkably improve yield by reducing the proportion of determining of unaccepted product in visual appearance inspection of a width dimension of a side surface electrode. SOLUTION: The method is provided with a precess of forming a plurality of combinations of upper surface electrodes 14 over any one of split grooves 11 in all directions of split grooves 11 on the upper surface of a sheet-like substrate 12 having the split grooves 11 in all directions. In this method, in any one of the split grooves 11 in all directions of split grooves 11, the depth of a portion where the plurality of combinations of the upper surface electrodes 14 are formed is made deeper than the depth of a portion positioned between the plurality of combinations of upper surface electrodes 14. COPYRIGHT: (C)2007,JPO&INPIT
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