| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor device for sufficiently reducing warp of a package even when an area of dummy chip is small. SOLUTION: The semiconductor device comprises a wiring board, a plurality of semiconductor chips of different sizes loaded through lamination on the wiring board, dummy chips arranged in parallel to a semiconductor chip of the uppermost layer of a plurality of semiconductor chips, and resin material for sealing a plurality of semiconductor chips and dummy chips. Moreover, the dummy chip is thicker than the semiconductor chip of the uppermost layer. COPYRIGHT: (C)2007,JPO&INPIT |
