发明名称 SENSOR PACKAGE AND METHOD OF MANUFACTURING SAME
摘要 PROBLEM TO BE SOLVED: To provide a highly reliable sensor package, and to provide a method for easily manufacturing such a sensor package. SOLUTION: The sensor package includes a sensor body, a protective material opposite to an active surface of the sensor body via a gap portion, and a joining member circularly arranged on the outside region of the active surface of the sensor body and joining the sensor body to the protective material so that the gap portion is hermetically sealed. The protective material is configured so that a minute through hole drilled on a portion positioned on the gap portion is closed with a closing member and a plurality of engaging convex portions abutting on the sensor body are provided on the outside of an active surface opposing portion. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007165495(A) 申请公布日期 2007.06.28
申请号 JP20050358517 申请日期 2005.12.13
申请人 DAINIPPON PRINTING CO LTD 发明人 KURAMOCHI SATORU;FUKUOKA YOSHITAKA
分类号 H01L23/02 主分类号 H01L23/02
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