| 摘要 |
The invention provides a circuit board having a plurality of pads, each pad including a non-conductive substrate defining an aperture for receiving a wire or a lead of a component, and a conductive area that encloses the aperture, and a trace that electrically connects the pad to an adjacent pad, with the conductive area that encloses the aperture being spaced away from the aperture so as to define a surrounding, intermediate non-conductive zone between the aperture and the conductive area. The invention also provides a method of manufacturing said circuit board. |
