| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the thickness of a dielectric plate in a plasma processing device while obtaining a mechanical strength in consideration of the deformation of the dielectric plate when a pressure is reduced in a chamber. <P>SOLUTION: The plasma processing device comprises a beam-like spacer 7 which is opposed to a substrate 2 and is disposed on the top opening of a chamber 3. The beam-like spacer 7 comprises a ring-shaped outer peripheral portion 7a having an underside 7d supported by the chamber 3, a central portion 7b disposed at the center of an area surrounded by the outer peripheral portion 7a in plan view, and a plurality of beam portions 7c radiating from the central portion 7b to the outer peripheral portion 7a. <P>COPYRIGHT: (C)2007,JPO&INPIT |
