| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a slim type backlight unit capable of decreasing thickness and weight, reducing a manufacturing cost, and increasing heat dissipation efficiency. <P>SOLUTION: The slim type backlight unit is configured by including a flexible printed circuit board where one throughhole or more are formed and an LED package connected to an upper side of the flexible printed circuit board at a region corresponding to the throughholes. The backlight unit has merits that the reduction of the thickness and weight allow the unit to be slimmer and more lightweight, thereby enabling the system to reduce the manufacturing cost because the flexible printed circuit substrate is used in place of a metal printed circuit board substrate as a member that transmits current to the LED package, and moreover heat generated from the LED package can be dissipated more quickly because, the LED package is directly connected to a bottom plate of the unit with a radiative adhesive. <P>COPYRIGHT: (C)2007,JPO&INPIT |
