| 摘要 |
PROBLEM TO BE SOLVED: To prevent a solder bridging in the whole lead and increase a joint strength between the lead and an electrode pad for a printed-wiring board. SOLUTION: In a surface mounting part, the gull-wing lead 4 with a formed trapezoidal trench wall 5 with a solder 6 filled therein is formed to a surface brought into contact with the electrode pad 2 on the printed-wiring board 1. COPYRIGHT: (C)2007,JPO&INPIT
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