发明名称 HOLDING FIXTURE AND DEVICE FOR HOLDING MINIATURE ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a holding fixture having an adhesive force adjusted by varying the thickness of a rubber elastic member, and to provide a device enabling each holding fixture to hold a miniature electronic component and substituting a holding fixture with another holding fixture for holding the miniature electronic component by varying the thickness of each of rubber elastic members in a plurality of holding fixtures. SOLUTION: The holding fixture has the rubber elastic member having an adhesive characteristic in which the relation between the adhesive force and the thickness satisfies Y=aX+b. The device includes the first holding fixture and a second holding fixture having a second rubber elastic member thinner than the thickness of the rubber elastic member of the first fixture, wherein the first and second holding fixtures can be arranged so that their rubber elastic members can oppose with each other. In the above formula, a is -20 to -5, b is 50 to 85, Y denotes the adhesive force (unit: g/mm<SP>2</SP>) and X denotes the thickness 0.3-2.0 (unit: mm). COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007165397(A) 申请公布日期 2007.06.28
申请号 JP20050356618 申请日期 2005.12.09
申请人 SHIN ETSU POLYMER CO LTD 发明人 HARUNO HIROSHI
分类号 H01G13/00;H01F41/04 主分类号 H01G13/00
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