| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the provision of a particular device on a substrate for traceability, to grasp inexpensively in-plane coordinate information of individual element chips without unnecessarily causing an increase of the number of manufacturing processes/complicatedness, and to greatly contribute to supply of highly reliable devices. SOLUTION: A chip specifying part 23 verifies image data of processed traces at four corners of an LSI chip, an investigation object of traceability, i.e., contact traces 12 or the contact traces 12, and dicing traces 13 with each image data stored in a storage 22, and specifies a formation position of the LSI chip on a semiconductor wafer. COPYRIGHT: (C)2007,JPO&INPIT
|
