| 摘要 |
An exemplary motherboard assembly includes a printed circuit board (PCB), and a heat sink. The PCB includes an electronic component mounted thereto. The heat sink includes a main body, and a shielding member mounted to a bottom of the main body. The shielding member defines an opening therein for accommodating the electronic component. The shielding member is sandwiched between the bottom of the main body and the PCB. The heat sink can remove heat generated by the electronic component and shield EMI generated by the electronic component, as well.
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