| 摘要 |
To promote miniaturization of an electronic-component mounted device, in which a larger number of electronic components are mounted on a mounting base, while increasing a number of electronic components mounted on the mounting base, disclosed is a double-side mounting apparatus including: a first compression-bonding tool and a second compression-bonding tool arranged opposite to each other; heating means for heating the first and second compression-bonding tools; pressurizing means for applying a pressure load between the first and second compression-bonding tools; a workpiece retention mechanism for retaining a mounted workpiece in between the first and second compression-bonding tools; a first protective-tape supply mechanism for supplying a first protective tape, in between the first and second compression-bonding tools, to the first compression-bonding tool; and a second protective-tape supply mechanism for supplying a second protective tape, in between the first and second compression-bonding tools, to the second compression-bonding tool.
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