摘要 |
A rack mount memory module is provided to reduce the occupancy area of a memory module on a mother board by vertically mounting a memory package on a backboard. A plurality of sockets(111) are formed on one surface of a backboard(110), and the other surface of the backboard is mounted on a mother board. A frame(120) includes a plurality of support bars(121) and a plurality of connection bars(122). One side end of the support bar is coupled to each corner of one side of the backboard, and the other side ends of the support bar are interconnected by the plurality of connection bars. One side end of a plurality of guide rails(130) is coupled to the backboard, and the other side end of the plurality of guide rails is coupled to the frame. A plurality of memory packages(140) are mounted on a PCB, and a part of the PCB is inserted into the socket by the guide rail.
|