| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminated electronic component manufacturing method for reducing occurrence of cracks due to a difference in contraction behavior during baking even when a dielectric layer is thinned. <P>SOLUTION: The method is used for manufacturing a laminated electronic component having an inner layer which is composed by alternately laminating an internal electrode layer and an inner dielectric layer, and an outer layer composed of an outer dielectric layer. The method has a step for forming an outer green sheet of the outer dielectric layer after baking while using paint for the outer green sheet, a step for forming an inner green sheet being the inner dielectric layer after baking while using paint for the inner green sheet, a step for obtaining a laminated body by laminating the inner green sheet via an electrode layer, and a step for obtaining a green chip by laminating the outer green sheet onto both end faces in a lamination direction of the laminated body. Dielectric powder crushed so that a crushing rate of a D50 diameter becomes 4.0-15.0% is used as outer dielectric powder made to be contained in the paint for the outer green sheet. <P>COPYRIGHT: (C)2007,JPO&INPIT |
