| 摘要 |
PROBLEM TO BE SOLVED: To realize speed-up of a soldering process by shortening the fusion time of a solder membrane, and to surely avert the thermal influence on a semiconductor element etc., and to make a contribution to an improvement in the membrane quality and homogeneity due to stabilization of a fusion temperature and fusion time. SOLUTION: In forming the solder membrane 1 by vapor deposition of an Au-Sn alloy 10 on a substrate 20, Au constituting the Au-Sn alloy 10 is included at 50 to 80 wt.% in the Au-Sn alloy 10, and the Au-Sn alloy 10 is formed by evaporating the Au and the Sn respectively simultaneously from evaporation sources 31x, 31y to perform vapor deposition, and thereby the solder membrane 1 containing at least Au<SB>5</SB>Sn, AuSn and AuSn<SB>2</SB>as crystal components of the Au and the Sn constituting the Au-Sn alloy 10 is formed. COPYRIGHT: (C)2007,JPO&INPIT
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