| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a mounting substrate, on which semiconductor chips are mounted, that has high reliability in interconnects connecting to the semiconductor chips, thus resulting in a good fabrication yield. SOLUTION: The manufacturing method for a mounting substrate on which semiconductor chips are mounted, includes an interconnect formation step of forming interconnects through electrolytic plating by feeding power to a first surface of a support substrate, made of insulating materials, from a power feeding layer formed on a second surface of the support substrate using a via plug that penetrates through the support substrate, a patterning step of forming a conductive pattern connected to the interconnects through the via plug, a testing step of performing a connection test for the interconnects, a mounting step of mounting semiconductor chips onto the interconnects, and a removal step of removing the support substrate. COPYRIGHT: (C)2007,JPO&INPIT
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