PACKAGING METHOD AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a packaging method capable of protecting an electrically connected part against invasion of moisture or the like by an underfill material, and keeping electrical connection even if deformation occurs on an electric component. SOLUTION: A conductive adhesive 7 having conductivity and with a low elastic modulus even in a cured state is supplied to the electrode 3 of the electric component 2 to make electrical connection via the conductive adhesive 7. The underfill material 6 with the low elastic modulus even in the cured state is filled between the component 2 and a substrate 1. COPYRIGHT: (C)2007,JPO&INPIT