| 摘要 |
PROBLEM TO BE SOLVED: To provide a conductive particle having a small amount of thermal shrinkage in baking, and to provide a reliable electronic component having a conductive layer formed by baking the conductive particle. SOLUTION: The surface of a mother particle 2 made of barium titanate (BaTiO<SB>3</SB>) is coated with a covering layer 3 made of nickel to manufacture the conductive particle 1. The diameter of the conductive particle 1 is set to 0.1-1 micron, for example 0.2 micron; the diameter of the mother particle 2 is set to approximately 80% of that of the conductive particle 1; and the thickness of the covering layer 3 is set to approximately 10% of the diameter of the conductive particle 1. The conductive particle 1 is mixed with an organic vehicle to prepare the conductive paste, and the conductive paste is applied to a ceramic green sheet, which is laminated and baked, thus manufacturing MLCC. In this case, the covering layers 3 are connected to form a current path. However, the mother particles 2 are hardly deformed, thus restraining thermal shrinkage. COPYRIGHT: (C)2007,JPO&INPIT |
