| 摘要 |
PROBLEM TO BE SOLVED: To realize a soldering device capable of conducting a flow-dipping soldering by reducing a supply flow rate per a unit time of an inert gas, that is, a consumption. SOLUTION: A chamber body 106 coating a carrier conveyor 107 is fitted together with the carrier conveyor 107, an inert-gas supply nozzle 114 supplying the inside of the chamber body 106 with the inert gas 7 is fitted to the chamber body 106, and the integrally fitted carrier conveyor 107 and chamber body 106 are moved in the vertical direction to the molten-solder liquid surface of a solder tank 109. Actuators 118 and 119 are mounted, and a controller controls movements in the vertical direction of the actuators 118 and 119 and controls the surface to be soldered of a printed-wiring board 3 carried by the carrier conveyor 107 so as to be brought into contact with plane flow waves 6. COPYRIGHT: (C)2007,JPO&INPIT |
