发明名称 Localized microelectronic cooling apparatuses and associated methods and systems
摘要 Apparatuses and associated methods and systems to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a microelectronic cooling apparatus comprising a microelectronic device thermally coupled to one or more thermally conductive pin(s) provides cooling to one or more hot spot(s) of the microelectronic device.
申请公布号 US2007144182(A1) 申请公布日期 2007.06.28
申请号 US20050319297 申请日期 2005.12.27
申请人 SAUCIUC IOAN;CHRYSLER GREGORY M 发明人 SAUCIUC IOAN;CHRYSLER GREGORY M.
分类号 F25B21/02;F25D23/12 主分类号 F25B21/02
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