| 摘要 |
A multi-layer package structure and a fabricating method thereof are provided to implement a stable multi-layer package by fixing a laminate structure by a metal pin. A multi-layer package structure includes a lower substrate(400), an upper substrate(500), and a connection unit of an end of a metal pin. The lower substrate(400) has a first signal line which is formed on an upper part, and at least one metal pin which is connected to the first signal line and has a high aspect ratio. The upper substrate(500) is laminated on the upper part of the lower substrate(400), and has a second signal line which is formed on the upper part of the lower substrate(400), and at least one via-hole into which a metal pin of the lower substrate(400) is inserted. The connection unit of the end of the metal pin connects the metal pin inserted into the via-hole with the second signal line. The connection unit is a solder unit or a metal direct bonding unit. |
