| 摘要 |
<P>PROBLEM TO BE SOLVED: To accurately detect open failure of a bonding wire that is wire-bonded to an object to be processed. <P>SOLUTION: When each of bonding wires 14a-14c is normally wire-bonded, electrode pads 18a-18c for grounding are connected to a ground of DC power Vcc from the respective bonding wires through an inner lead terminal 12b, so that a voltage value of the electrode pad is 0 V for grounding. However, once open failure occurs in the bonding wires 14a-14c, the electrode pads 18a-18c for grounding connected with the bonding wire float from the grounding, so that the electrode pad for grounding floating from the ground displays higher voltage than 0 V. At that time, the level of output signals of comparators 22 and 23 are judged by a judgment circuit 24, thus accurately detecting the presence or absence of open failure for each of the bonding wires 14a-14c. <P>COPYRIGHT: (C)2007,JPO&INPIT |
