| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a highly reliable lead frame for semiconductor device ensuring superior heat radiation, and also to provide a manufacturing method therefor. <P>SOLUTION: The lead frame is covered with a circumferential edge; and a heat radiating plate is deposited with pressure to an aperture by providing the aperture which has completed the burring process to the area, except for an external frame of a tab within the tab of a lead frame, inserting the heat radiating plate formed in the shape of a step into this aperture; and by applying mechanical pressure to the circumferential edge of the upper surface of the heat-radiating plate using a punch or the like. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
