| 摘要 |
PROBLEM TO BE SOLVED: To provide a contact mechanism for economically and stably connecting the terminals of semiconductor chips in the upper and lower layers arranged by a closed pitch in an SiP(system-in-package) where a plurality of semiconductor chips are laminated in thickness direction. SOLUTION: In an SiP including a plurality of semiconductor chips, electric connection between upper and lower laminated semiconductor chips, between the semiconductor chip and a packet direct material and/or direct materials on which the semiconductor chips are set is carried out by holding a contact layer configured by putting a contact member(ring) formed of conductive metallic thin wires through a through-hole formed in an insulating layer constituted of a heatproof insulating film or the like between the upper layer and lower layer to be connected, and electrically connecting the terminals of the upper and lower laminated layers by the contact member put through the contact layer. COPYRIGHT: (C)2007,JPO&INPIT
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