| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing a wiring board having high reliability, at low cost. SOLUTION: The manufacturing method for the wiring board contains a process for preparing a board 100 with a base board 10, a conductive film 20 formed on the surface of the base board 10, and a plurality of leads 30 formed on the conductive film 20; and the process for forming resist layers 40 partially coating regions among the adjacent two leads 30 in the conductive film 20, so as to be brought into contact with the adjacent two leads 30. The manufacturing method further contains the process for forming conductive patterns 50, electrically connecting a plurality of the leads 30 by patterning the conductive film 20, and an electroplating treating process for plating and treating the leads 30 by making a current flow through a plurality of the leads 30 via the conductive patterns 50. The manufacturing method further includes the process for electrically insulating a plurality of the leads 30, respectively by cutting the conductive patterns 50. COPYRIGHT: (C)2007,JPO&INPIT
|
