FLIP-CHIP TYPE SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING FLIP-CHIP TYPE SEMICONDUCTOR LIGHT-EMITTING DEVICE, PRINTED CIRCUIT BOARD FOR FLIP-CHIP TYPE SEMICONDUCTOR LIGHT-EMITTING DEVICE, MOUNTING STRUCTURE FOR FLIP-CHIP TYPE SEMIC

摘要

A flip-chip type semiconductor light-emitting device having a positive electrode and a negative electrode similar in electrode area and capable of preventing the misalignment of the light-emitting device by utilizing the self alignment effect in manufacturing a light-emitting diode lamp and a printed circuit board for the flip-chip type semiconductor light-emitting device are provided. Furthermore, adopted are a flip-chip type semiconductor light-emitting device 1 which is provided with a negative electrode pad and a positive electrode pad formed on the side opposite the transparent substrate side of the semiconductor layer, wherein each of the electrode pads is formed in the same shape as each other and a printed circuit board for the light-emitting device has a pair of the electrode patterns which are formed in the same shape as each other. Still furthermore, a soldering film is included in each of the electrode pads.