| 摘要 |
The invention relates to a method for electroplating an article having a nanostructure to be plated in an electroplating apparatus comprising an electrolytic solution, as well as a first and a second pole for forming a cathode and an anode, respectively, in the electrolytic solution and a voltage source for applying a potential difference between the two poles. The method comprises the steps of electrically connecting the article having a nanostructure to be plated to the first pole and placing the article in the electrolytic solution, and forming a second metal film on the primary conductive layer by causing metal ions from the electrolytic solution to precipitate on the article having a nanostructure to be plated by applying a potential difference for a period of time between the second pole, which is connected as the anode, and the first pole, which is connected as the cathode. First a DC voltage is applied, and subsequently a periodically reversible voltage. |
