| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board with which an aspect ratio of a circuit formed by an additive method is 1:1 or more, a highly precise circuit can be obtained by a simple method, a deviation in installing position or installing angle of an exposure head and a variation in resolution of a pattern or concentration unevenness can be reduced, and the pattern can be highly precisely and efficiently formed. <P>SOLUTION: The manufacturing method of the circuit board includes a photosensitive layer formation step of laminating a photosensitive layer with a thickness of 40 μm or thinner overlappingly a plurality of times to form the photosensitive layer, an exposure step of exposing the photosensitive layer, a development step, a circuit formation step of burying metal by the additive method to form the circuit, and a cured part exfoliation and removal step of exfoliating and removing a cured part after the formation of the circuit. <P>COPYRIGHT: (C)2007,JPO&INPIT |
