发明名称 BASE MATERIAL FOR SEMICONDUCTOR DEVICE, AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a base material for a semiconductor device capable of obtaining a light emission device which has an excellent surface state, obtains high light emission efficiency by reducing a dislocation density, and has a large effective light emission wavelength range; and to provide its manufacturing method. <P>SOLUTION: The base material for the semiconductor device includes a substrate, a superlattice structural layer formed on the substrate, and a base layer for function element formation which is formed on the superlattice structural layer and composed of an AlGaN semiconductor compound. The superlattice structural layer has a periodical structure where not less than three lamination units are superimposed, which are composed of a first low crystalline layer including the AlGaN semiconductor compound lower in crystalline compared with the base layer for function element formation, and a second low crystalline layer including the AlGaN semiconductor compound larger in Al composition ratio compared with the first low crystalline layer. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007165576(A) 申请公布日期 2007.06.28
申请号 JP20050359876 申请日期 2005.12.14
申请人 UNIV OF TOKUSHIMA;USHIO INC 发明人 SAKAI SHIRO;SUMIYOSHI KAZUHIDE;TSUKIHARA MASASHI;KATAOKA KEN
分类号 H01L21/205;C23C16/34;H01L33/06;H01L33/12;H01L33/32 主分类号 H01L21/205
代理机构 代理人
主权项
地址