发明名称 LED MOUNTING SUBSTRATE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an LED mounting substrate capable of effectively diffusing the heat of an LED to the outside, a manufacturing method capable of easily manufacturing the LED mounting substrate at a low cost, and a drill capable of surely forming a recess with a roughly flat bottom surface on the LED mounting substrate. <P>SOLUTION: By turning a substrate material to a structure for which an organic layer 3 such as a prepreg sheet and a metal layer 4 for heat radiation such as aluminum or rolled copper are laminated, workability and operability are improved, heat conductivity is improved by the metal layer 4 for the heat radiation, and the heat is efficiently diffused to the outside. Also, a hole is provided on a part corresponding to the recess 4 of the metal layer 4 for the heat radiation, the metal layer 4 for the heat radiation is prevented from being exposed to the wall surface of the recess 5, and the short-circuit of an electrode is prevented. Also, by using a drill bit having a flat part on the distal end, the recess with the roughly flat bottom surface is directly formed on a substrate member 2 for which the metal layer 4 for the heat radiation and the organic layer 3 are laminated. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007165735(A) 申请公布日期 2007.06.28
申请号 JP20050362613 申请日期 2005.12.16
申请人 DRILL CENTER:KK 发明人 TAKASHI HIROSHI
分类号 H01L33/60;H01L33/62;H01L33/64 主分类号 H01L33/60
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