摘要 |
PROBLEM TO BE SOLVED: To provide a wafer cleaning apparatus simple in construction and easy in maintenance. SOLUTION: The wafer cleaning apparatus 31 includes a cleaning vessel 32 with a cleaning liquid 37 stored therein; an ultrasonic generator 36 generating ultrasonic waves inside the cleaning liquid 37; and a cassette 34 which is arranged to be put-in/taken-out with respect to the cleaning vessel 32, housing a plurality of wafers 33 with a clearance each other. Further, the apparatus has a vertically moving mechanism 35 which supports the cassette 34 inside the cleaning vessel 32, and is movable vertically, and a torque applying member 50 which is constituted inside the cleaning vessel 32 by an elastic body, makes the wafer 33 rotate by elastically being deformed by contacting with the wafer 33 inside the vertically movable cassette 34. COPYRIGHT: (C)2007,JPO&INPIT
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