WORKING METHOD ON SEMICONDUCTOR WAFER COMPRISING CLEAVED SURFACE, AND SEMICONDUCTOR WAFER OBTAINED THEREBY

摘要

PROBLEM TO BE SOLVED: To provide a working method of a semiconductor wafer comprising a cleaved surface capable of obtaining a wafer of stable precision. SOLUTION: A semiconductor wafer provided by slicing from a semiconductor single crystal ingot is worked in an etching process for removing work distortion of the wafer, before a chamfering process for chamfering the wafer. COPYRIGHT: (C)2007,JPO&INPIT