| 摘要 |
PROBLEM TO BE SOLVED: To reduce the size of a device for conveying and aligning minute components such as chip components. SOLUTION: On an oscillation stage 7, a piezoelectric element 4 generating vertical oscillation is coupled to a piezoelectric element 5 generating horizontal oscillation. When sinusoidal signals with the same phases are applied to the piezoelectric elements 4, 5, a chip component is conveyed from a component placing part 9a to a conveyance groove 9b, inserted into a notch 15 of a holding plate 14 positioned opposing to a take-out port of the conveyance groove 9b, and is hold. When clogging and catching occur during conveyance of the chip component, sinusoidal signals with opposite phases are applied to the piezoelectric elements 4, 5. Due to this, conveyance force in the direction from the conveyance groove 9b to the component placing part 9a is applied to the chip component, and the chip component is conveyed to the chip placing part 9a side. By controlling phase relationship between the sinusoidal signals applied to the piezoelectric elements 4, 5, clogging etc. of the chip component can be eliminated without providing an additional mechanism. COPYRIGHT: (C)2007,JPO&INPIT
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