发明名称 Encapsulation composition for pressure signal transmission and sensor
摘要 An encapsulation composition for pressure signal transmission including a flexible and low modulus epoxy resin as a substance in combination with plastic balls with pressure signal transmission properties as filler is provided. Therefore, the pressure signal is transmitted by utilizing the property of easy deformation of the flexible epoxy resin under pressure. And the effect of signal transmission is enhanced by the contact between plastic balls. The encapsulation composition is used in a sensor for transmitting pressure signals. The encapsulation composition is hydrophobic, so an electronic device of the sensor can be protected against moisture or water to extend its lifetime. Compared with traditional sensors using liquid for transmitting pressure signal, this sensor using solid encapsulation composition has advantages such as easy production and processing.
申请公布号 US2007148469(A1) 申请公布日期 2007.06.28
申请号 US20060374697 申请日期 2006.03.13
申请人 TSENG FENG-PO;CHIOU KUO-CHAN;LEE TZONG-MING;CHENG SYH-YUH;HSU CHIH-WEI 发明人 TSENG FENG-PO;CHIOU KUO-CHAN;LEE TZONG-MING;CHENG SYH-YUH;HSU CHIH-WEI
分类号 B32B27/38;B32B27/04;B32B37/00;C08L63/00 主分类号 B32B27/38
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