MODULE HAVING BUILT-IN COMPONENT AND METHOD FOR FABRICATING SUCH MODULE

摘要

[PROBLEMS] To provide a module having a built-in component by which the cost can be reduced and the yield can be improved. [MEANS FOR SOLVING PROBLEMS] A module (A) having a built-in component comprises: a module substrate (1) having a first wiring (2) on its upper surface; a first circuit component (7) mounted on the first wiring on the module substrate; a sub-module substrate (10) mounted on the first wiring in an area on the module substrate other than the area where the first circuit component is mounted and having an area smaller than that of the module substrate; a second circuit component (15) mounted on a second wiring (11) on the upper surface of the sub-module substrate; and an insulating resin layer (20) so formed on the entire upper surface of the module substrate as to cover the first circuit component, the second circuit component, and the sub-module substrate. Since a substrate having a wiring precision higher than that of the module substrate (1) is used as the sub-module substrate (10), an integrated circuit element (15a) can be mounted on the sub-module substrate, and the highly reliable and low cost module having the built-in component is provided.