| 摘要 |
<p>1,263,703. Direct connections. JOSEPH LUCAS (INDUSTRIES) Ltd. 18 July 1969, [9 Aug., 1968], No. 38065/68. Heading H2E. [Also in Division H1] A wafer 11 containing a PN junction is soldered to a conductive support (not shown) acting as one terminal of the device and a second terminal 13 is soldered to the other face of the wafer. The second terminal 13 has a convex (for example, part-spherical) surface 16 in point contact with the wafer so that the solder can flow between the parts to form a good bond. The solder also flows over the concave neck 15 of the terminal to further anchor the parts when it has solidified.</p> |
