发明名称 CIRCUITS AND METHOD OF OPTION IN SEMICONDUCTOR DEVICE
摘要 An option circuit of a semiconductor chip and a method thereof are provided to change a fuse option through an electric fuse or a soldering option after assembling a package, by selectively controlling the fuse option, the soldering option, or the electric fuse through a mode register setting option. An option circuit of a semiconductor chip is composed of a package pre-option circuit(22) programmed in a wafer test step to output a first option signal(WOP) for setting an operation mode of the semiconductor chip as a first option mode; a package post-option circuit(24) programmed in a package test step to output a second option signal(POP) for setting the operation mode of the semiconductor chip as a second option mode; and a selection circuit(26) for receiving the first and second option signals to set the final operation mode of the semiconductor chip, selecting one of the first and second option signals by external control signals(CON1,CON2), and outputting one selected option signal.
申请公布号 KR100735568(B1) 申请公布日期 2007.06.28
申请号 KR20060006667 申请日期 2006.01.23
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, JAE HYUNG
分类号 G01R31/28;G01R31/26 主分类号 G01R31/28
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