发明名称 |
AN ABSTRACT PROCESSING A GATE PORTION IN A SEMICONDUCTOR MANUFACTURING APPARATUS, WHICH REMOVES A GATE CORRESPONDENCE PORTION FROM A SEMICONDUCTOR PACKAGE CONNECTED TO A LEAD FRAME, AND A RESIN BURR DEPOSITED ON A LEAD PORTION ASSOCIATED WITH THE SEMICONDUCTOR PACKAGE |
摘要 |
<p>An apparatus processing a gate portion in a semiconductor manufacturing apparatus includes a laser beam scanner unit and a cutter. The laser beam scanner unit is disposed along a carrying line on which a lead frame is carried. The laser beam scanner unit has an optical scanner unit second-dimensionally scanning laser beams, and a lens unit collecting the laser beams. The cutter has a punch. The punch mechanically pushes to cut a gate correspondence portion which is perfectly cut away or almost cut away from a semiconductor package body by the laser beams.</p> |
申请公布号 |
SG132490(A1) |
申请公布日期 |
2007.06.28 |
申请号 |
SG20010032614 |
申请日期 |
2001.06.01 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
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分类号 |
B21D28/00;B23K26/00;B23K26/40;B23K101/40;H01L21/48;H01L21/56;(IPC1-7):H01L21/48;H01L21/02;H01L21/44;H01L21/50 |
主分类号 |
B21D28/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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