发明名称 POLISHER, SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING IT, AND SEMICONDUCTOR DEVICE MANUFACTURED BY THE METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a polisher, reducing the time required for replacing a pad plate. <P>SOLUTION: In this polisher, a pad plate 33 for replacement is held on a plate holding mechanism 50 in the standby position, a polishing head 20 where the pad plate 33 is removed from a carrier member 24 is moved to the replacement position, and the pad plate for replacement held on the plate holding mechanism 50 is moved from the standby position to an upper position, whereby the pad plate 33 for replacement is engaged with an engagement hole part 32 of the carrier member 24 and mounted and held on the carrier member 24. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007160415(A) 申请公布日期 2007.06.28
申请号 JP20050356640 申请日期 2005.12.09
申请人 NIKON CORP 发明人 ASADA NAOKI
分类号 B24B37/20;B24B37/34;H01L21/304 主分类号 B24B37/20
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