| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayered wiring board for a semiconductor device by which external connection terminals can be accurately formed in a multilayered wiring board made by using a detachable metal foil. <P>SOLUTION: In manufacturing the multilayered wiring board for a semiconductor device, a detachable metal foil is used which is made by bonding a first metal foil 10a thicker than the projecting height of bumps 20 as the external connection terminals, and a second metal foil 10b thinner than the first metal foil 10a together via an adhesive layer so that the metal foils can be detached. A substrate is bonded to the second metal foil 10b side to form a support substrate. Concave portions 18 for bumps which are formed in the first metal foil 10a are filled with plating to form the bumps 20, and a conductor pattern 22 connected to the bumps 20 is formed on the surface of the first metal foil 10a. Thereafter, a multilayered wiring board 30 including the bumps 20 and the conductor pattern 22 is formed on the first metal foil 10a. Then, after separating the first metal foil 10a and the second metal foil 10b, the first metal foil 10 bonded to the multilayered wiring board 30 is removed by etching to expose the bumps 20 and 20, etc. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
