| 摘要 |
PROBLEM TO BE SOLVED: To provide a vertical in-line sputtering apparatus for sputter-treating a substrate to be treated while setting the target and the substrate at an upright and parallel-opposed state and transporting them in the state, which adopts a holding method capable of solving problems of lowering yield and quality due to vibration during transportation, damage of the substrate and move of the substrate. SOLUTION: The sputtering apparatus is directed at forming a film on one surface side of the substrate 20 by sputtering treatment while transporting the substrate in the line, and arranges the substrate 20 and the target 30 so that the surface side to be film-formed of the substrate 20 faces to the target 30 in parallel and both of them stand in a vertical direction 62 or diagonally tilting from the vertical direction. The carrier has an electrostatically absorbing part that electrostatically absorbs at least one part of the substrate from a back side of the mounted substrate, which is not a surface side to be treated, or in a region not to be treated in the surface side to be treated of the mounted substrate, and that makes a position of the substrate in a surface direction held by a fixed support member. COPYRIGHT: (C)2007,JPO&INPIT
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