| 摘要 |
PROBLEM TO BE SOLVED: To shorten the distance between the both electronic parts by avoiding the interference of a collet between adjoining electronic parts, in the mounting method of electronic parts in which electronic parts are mounted on one face of a substrate by sucking electronic parts using the collet. SOLUTION: The arrangement of electronic parts 11, 12 is determined so that the mutual upper position of the adjoining electronic parts 11, 12 in the state after mounting has a height difference h1; and at the same time, among the adjoining electronic parts 11, 12 in the state after mounting, the second part 12 whose upper end position is made to be lower is made to be mounted ahead of the first parts 11 which is made to be upper. Further, the length A toward the lower portion from the upper portion of the protrusion 220 protrudes from the periphery of the upper end within the openings 210 of the collet 200 when the upper end of the first part 11 is sucked, is made to be less than the height difference h1. COPYRIGHT: (C)2007,JPO&INPIT |
