| 摘要 |
PROBLEM TO BE SOLVED: To provide tape pasting equipment and a tape pasting method, capable of coping to both cases where a notching to the shape of a plate member or a ring frame is formed on a tape base material, and a case where no notchings are formed. SOLUTION: A master roll L, where a strip of tape base material TB having a die-bonding sheet section DS with a size substantially corresponding to the shape of a semiconductor wafer W is adhered temporarily, is delivered to a strip of release sheet S. A detector 14 detects whether a notching C is formed at the outer-peripheral side of the die-bonding sheet section DS in the middle of delivery. When it is determined that the notching C is formed as a result of this detection, die-cutting equipment 13 allows the master roll L to pass through, without stopping without forming any notchings C, when it is determined that the notchings C are formed as a result of the detection. When no notchings C are detected, the die-cutting equipment 13 forms the notchings C and forms a pasting tape DDT. The pasting tape DDT is peeled by the peeling device 15 and is pasted to the ring frame RF, while the die-bonding sheet DS nearly coincides with the semiconductor wafer W. COPYRIGHT: (C)2007,JPO&INPIT |
