发明名称 METHOD OF MANUFACTURING PRINTED WIRING BOARD HAVING COMPONENT MOUNTING PIN
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board having a component mounting pin for connecting a printed wiring board and an electronic component. SOLUTION: In the method of manufacturing the printed wiring board (1) having the component mounting pin (18) has a step of forming a component mounting surface after forming the predetermined number of layers. This step includes processes of forming a conductor land (11) on the component mounting surface, covering the component mounting surface other than a portion of the conductor land with an insulation layer (12), partially forming a sacrificial layer (14) removable in a post process in the vicinity of the conductor land on the upper surface of the insulation layer, forming conductor layers (16, 17) on the top surfaces of the conductor land and the sacrificial layer and pattering the conductor layers, partially removing the sacrificial layer (14) positioned below the patterned conductor layers (16, 17) to form the component mounting pin (18) extending from the conductor land, and erecting the component mounting pin. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007165381(A) 申请公布日期 2007.06.28
申请号 JP20050356119 申请日期 2005.12.09
申请人 IBIDEN CO LTD 发明人 KARIYA TAKASHI;FURUYA TOSHIKI;KASAI TAKESHI
分类号 H05K3/34 主分类号 H05K3/34
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