| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for an electronic component, capable of further reducing the fraction defective, when several electronic components are manufactured by separating from the motherboard. SOLUTION: The manufacturing method contains a board preparation process S01 for preparing the motherboard with a plurality of formed elements along a specified plane, and a notching process S02 for forming a pair of at least trenches so as not to reach the main surface and a rear surface that faces the main surface by forming notches from the main surface of the motherboard. The manufacturing method further contains an electrode-forming process S03 for forming electrodes by mask sputtering method from the main surface side to the sections forming the trenches, and a splitting process S05 for obtaining the electronic components by cutting them off at each element of the motherboard forming the electrodes. COPYRIGHT: (C)2007,JPO&INPIT
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