SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND MOUNTING METHOD OF THE SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To record information about manufacturing at high density and at low cost, and to easily recognize it. SOLUTION: Thirteen bands 13 are displayed in a plurality of colors on the rear surface 12 of a semiconductor chip 11, and the number of colors is specified as ten. Six bands 13 are assigned as cutting points from a wafer with five bands as lot number and two bands as wafer number. In this way, of 105kinds of lot numbers, 102kinds of wafer numbers, and cutting positions, from 106kinds of wafers, are displayed. The width and the interval of the bands 13 are 0.5 mm. Thus, by only looking at the rear surface 12 of the semiconductor chip 11, color array of thirteen bands 13 can be known; and by converting the color array into the array of number of 13 digits, manufacturing information is known easily. COPYRIGHT: (C)2007,JPO&INPIT